BondScan™:Bond Testing Instrument
BondScan™ instrument is designed for the inspection of multilayer material commonly used in the aerospace industry. The BondScan™ can perform Resonance inspection to detect disbonds, delaminations and thinner parts with a wide frequency band.
BondScan™ is compatible with most commercially available resonance probes and is specifically designed for scanning applications.
At the heart of this solution is TecView® BT, a state-of-the-art bond testing software that enables the user to quickly acquire data and perform advanced C-Scan analysis.
Computer controlled fully digital Bond Testing instrument!
Bond Testing instrument designed for automated testing applications.
Bond Testing Instrument (BondScan™)
TecScan’s BondScan™ instrument is designed to be fully integrated to automated systems. The instrument is available as a desktop and rack mount instrument and designed to be easily integrated in systems for Automated Testing of complex parts.
With its advanced digital design, the instrument operates at a very stable time-base which is combined with the high frequency converters allowing real-time C-Scan bond testing. It works with our TecView® BT software for manual and advanced automated non-destructive testing. BondScan™ is designed with applicability in mind, with specifications that can meet the most challenging automated testing applications.
When used with the ARMANDA automated XY scanner, high-resolution C-Scan images can be generated from the detect signal amplitude and phase changes. This provides an accurate C-Scan representation of thickness changes caused by the presence of any disbonds in multi-layered laminate composites and with honeycomb sandwich cores.
Software Features:
- Resonance testing
- Imaging and Analysis module
- Real-time impedance and C-Scan display
- Live Alarms utilities
- Post-processing re-nulling and rotations
- Impedance components C-Scan imaging (amplitude, phase, etc.)
- Phase information can be displayed as thickness C-Scan
- Alarm based C-Scan imaging
- 3D projection for better illustration of defects
- Reporting capabilities
- Intuitive user-interface & menu
BondScan™ Instrument Specifications
Analog output full scale±10V
| Frequency | 1 kHz to 1 MHz |
| Rotation | 0 to 360 °, 0.1° steps |
| Output voltage | 0 to 20 Vpp, 0.1V steps |
| Preamplifier | 0 to 30 dB |
| Horizontal, Vertical gains | 0 to 90 db, 0.1 dB steps |
| Low pass filter | 1 Hz to 10 kHz |
| Analog outputs | Horizontal |
| Vertical | |
| External trigger input | TTL compatible |
| Control interface | USB |
| Digital data output | 16 bit, streaming via USB |
